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East Sun New Material Technology (Shenzhen) Co., Ltd.

East Sun New Material Technology (Shenzhen) Co., Ltd.

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5 Years
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Home / Products / TPU Hot Melt Adhesive Powder / Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications /

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TPU Hot Melt Adhesive Powder

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DTF Hot Melt Powder

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East Sun New Material Technology (Shenzhen) Co., Ltd.
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissAbby
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Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications
Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications
  • Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications
  • Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications
  • Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications
Products Detailed
Industrial Hot Melt Adhesive Tape for SIM Card and Bank Card Lamination Applications Product: DS-5 Description The hot melt adhesive is used in the ...
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